Micron Introduces HD DDR3 Components, Modules
November 13, 2007 // Published as a news service by IHS
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Micron Technology Inc. released a 2 Gb double-data-rate 3 (DDR3) dynamic random access memory (DRAM) component, enabling 8 GB and 16 GB modules for servers and 4 GB modules for desktop and notebook PCs.
This memory density can be used to optimize memory intensive operating systems, the company said. Micron is now sampling modules based on its 2 Gb DDR3 component for server, desktop and notebook applications.
Commercial availability for the product is planned for 1Q 2008.
"The graphic-intensive features and functionalities designed into today's new operating systems are requiring more and more memory to perform at optimal levels," said Shane Rau, program director for computing, networking and storage semiconductors at IDC.
"IDC forecasts that by the fourth quarter of 2008, the average desktop PC will contain nearly 2.1 GBs of DRAM, the average mobile PC over 1.8 GBs and the average x86 server over 11.2 GBs," Rau said.
Micron said its 78 nanometer (nm) 2 Gb DDR3 memory technology provides increased speeds of up to 1,333 Mbps, enabling better system and graphics performance, which provides for an interactive user experience. For example, when operating at peak performance, DDR3 can transfer a 100,000-page document in approximately one second.
By reducing supply voltage from 1.8 volts (V) to 1.5 V, the 2 Gb DDR3 provides a 20% to 30% memory power savings compared with DDR2 technology. The company said further memory power savings can be realized by using fewer components on a module. Reduced memory power consumption can save money on cooling costs in data center server systems and prolong battery life in notebook applications.
Source: Micron Technology Inc.