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Parts & Electronics Components News - 2007
June 1, 2007
IBM, Tech Partners to Develop, Manufacture 32 nm Semiconductors
IBM, Chartered Semiconductor Manufacturing, Samsung Electronics, Infineon Technologies AG and Freescale Semiconductor signed a series of semiconductor ... more
June 1, 2007
Freescale Expands Availability of Flash Programming for Consumer, Industrial MCUs
Freescale Semiconductor expanded the availability of flash programming services across its portfolio of microcontrollers (MCUs) for embedded ... more
June 1, 2007
Airbus Selects Dassault Systèmes Simulia Simulation for Nonlinear FEA of Aircraft Structures
Dassault Systèmes (DS) announced that Airbus adopted the Abaqus finite element analysis (FEA) software from its Simulia brand for static nonlinear ... more
June 1, 2007
Fujitsu Introduces H.264 HDTV CODEC with Integrated System Memory
Fujitsu Microelectronics Europe (FME) introduced the MB86H51, a semiconductor chip that can compress and decompress in real time high-definition ... more
June 1, 2007
Fujitsu Offers SmartMPEG-C Digital Television Decoder for PVR Applications
Fujitsu Microelectronics Europe released the SmartMPEG-C, a digital television (DTV) decoder designed for the set-top box (STB) and improved ... more
June 1, 2007
Jazz, Fujitsu to Manufacture SoC Products for 90, 65 nm RFCMOS Foundry Customers
Fujitsu Ltd. (Fujitsu), Fujitsu Microelectronics of America Inc. (FMA) and Jazz Semiconductor (Jazz) will work together to manufacture system-on-chip ... more
June 1, 2007
Renesas Releases R32C/118 Group 32 b MCUs with On-Chip Flash Memory
Renesas Technology Corp. introduced the R32C/118 group microcontrollers with on-chip flash memory as part of the R32C/100 series incorporating ... more
June 1, 2007
Intel, STMicroelectronics, Francisco to Provide Nonvolatile Flash Memories
STMicroelectronics (ST), Intel and Francisco Partners inked an agreement to create an independent semiconductor company. ... more
June 1, 2007
UGS PLM Software Announces UGS NX CAM Express Version 5
UGS PLM Software released UGS NX CAM Express Version 5 (V5) software featuring an enhanced user interface, preconfigured mill-turn environment, ... more
June 1, 2007
STMicroelectronics Announces Development Kit for STR9 ARM966E Core-Based MCUs with Ethernet Connectivity
STMicroelectronics (ST) released an evaluation and development kit for its STR91x 32 b microcontroller (MCU) family, which is based on the ARM966E ... more
June 1, 2007
Pericom Announces PCI Express Gen2 Signal Switches Supporting 5.0 Gbps Operation
Pericom Semiconductor Corp. in conjunction with the PCI Special Interest Group (PCI-SIG) announced production availability of a family of signal ... more
June 1, 2007
Xilinx Virtex-5 SXT FPGAs Achieve PCI Express v1.1 Compliance
XtremeDSP Virtex-5 SXT field-programmable gate arrays (FPGAs) from Xilinx Inc. passed the latest peripheral component interconnect (PCI) Express ... more
May 30, 2007
TI Introduces MSP430F47X4 MCUS for One-, Multi-Phase Metering
As utility companies adopt electronic-based meter reading technology to reduce costs while offering new services and energy-saving consumer options, ... more
May 25, 2007
Fujitsu Graphics Controller Combines CPU, Graphics Engine on Single Chip for Automotive Applications
Fujitsu Microelectronics America Inc. (FMA) introduced the MB86R01, a graphics display controller with a 32 b central processing unit (CPU) and ... more
May 25, 2007
Renesas Tech to Develop CPU Architecture for 16 b, 32 b Microcontrollers
Renesas Technology Corp. is developing a new central processing unit (CPU) architecture that it said will provide enhancements over previous-generation ... more
May 25, 2007
SST Ramps Production of Theseus Titanium Smart Card ICs
Silicon Storage Technology Inc. (SST) announced volume production availability of its Theseus Titanium 40 smart card integrated circuit (IC). ... more
May 25, 2007
Freescale Unveils Multicore Processor for Telematics, Consumer, Industrial Applications
Freescale Semiconductor introduced the MPC5121e, a system-on-chip (SoC) processor for high-performance, power-sensitive applications requiring ... more
May 25, 2007
Microsoft Certifies SST NANDrive for Windows ReadyBoost
The advanced technology attachment (ATA) solid-state NANDrive storage tool from Silicon Storage Technology Inc. (SST) received Windows ReadyBoost ... more
May 25, 2007
Samsung DDR3 Memory Components, Modules Validated for Intel DDR3 Chipsets
Twenty-one double data rate version 3 (DDR3) solutions made by Samsung Electronics Co. Ltd were validated on Intel Corp.'s reference platform ... more
May 25, 2007
Renesas Releases 200A IGBT for Electronic Flash Control in Mobile Phone, Digital Still Cameras
Renesas Technology Corp. announced the RJP4004ANS, an insulated gate bipolar transistor (IGBT) designed for electronic flash control in mobile ... more
May 25, 2007
SAES Getters, STMicroelectronics to Develop, Produce MEMS Gyroscopes
The SAES Getters Group and STMicroelectronics (ST) signed a cooperation agreement to integrate their technologies to develop and produce next-generation ... more
May 24, 2007
SDI Uses PTC Windchill for Design; Project, Information Management; Reduced Cycle Time
SDI Corp. implemented Windchill, the content and process management software from Parametric Technology Corp. (PTC), to improve design accuracy ... more
May 24, 2007
Kedah Selects Fujitsu Fixed WiMAX SoC for Russian 3.5 GHz Wireless Systems
Fujitsu Microelectronics America Inc. (FMA) will provide its MB87M3550 fixed WiMAX system-on-chips (SoCs) to Kedah Electronics Engineering for ... more
May 24, 2007
AMD Details Puma Next-Generation Platform for Notebook PCs
Advanced Micro Devices (AMD) disclosed details of its next-generation open platform for notebook computing. ... more
May 24, 2007
AMD Updates I/O Virtualization Tech Spec for x86-Based Applications
The Advanced Micro Devices (AMD) I/O virtualization technology specification revision 1.2 with more secure input/output (I/O) connections is ... more
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