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Parts & Electronics Components News - 2007
June 22, 2007
Renesas Offers Transistor Fabrication Tech for 45 nm Process Generation
Renesas Technology Corp. developed transistor technology with low-cost fabrication capability for microprocessors and system-on-a-chip (SoC) ... more
June 22, 2007
Fujitsu Signs Synnex to Distribute, Integrate HDDs, Ethernet Switches
Fujitsu Computer Products of America Inc. (FCPA) inked a distribution relationship with Synnex Corp. to ship Fujitsu enterprise and mobile hard ... more
June 22, 2007
Renesas Creates Tech to Implement On-Chip SOI SRAM of 32 nm Generation
Renesas Technology Corp. developed technology that it said can implement static random access memory (SRAM) in processes of the 32 nanometer ... more
June 22, 2007
ABI: Secure Processors for Consumer Electronics to Grow Quickly
In today's consumer electronics (CE) products, hardware integrated circuit (IC) features play little role in protecting copyrighted content. ... more
June 22, 2007
STMicroelectronics Unveils Design Platform for Low-Power Next-Generation 45 nm CMOS
STMicroelectronics (ST) unveiled details of its 45 nanometer (nm) (0.045 micron) complementary metal oxide semiconductor (CMOS) design platform ... more
June 22, 2007
Airbus, NEC Deploy Windchill from PTC to Manage Content, Build Knowledge Database
Parametric Technology Corp. (PTC) announced that two companies - Airbus and NEC - have adapted Windchill. ... more
June 22, 2007
MEN Mikro Elektronik Releases ESM with MPC8548 for Harsh Industrial Environments
MEN Mikro Elektronik introduced the EM6, an embedded system module (ESM), based on the Intel Core Duo or, alternatively, the Celeron M processor ... more
June 22, 2007
Fujitsu Develops Annealing, Multilayer Interconnect Tech for 45 nm Logic Chips
Fujitsu Ltd. and Fujitsu Laboratories Ltd. developed a platform technology for 45 nanometer (nm) generation latent semantic indexing (LSI) logic ... more
June 21, 2007
Midmarket Customers Adopt Dassault Systèmes CATIA PLM Express
According to Dassault Systèmes (DS), smaller enterprises are using CATIA PLM Express, its DS product lifecycle management (PLM) tool for the ... more
June 21, 2007
Avnet Tech Solutions, ASUS Expand Relationship to Cover Motherboard Marketplace in Mainland China
Avnet Technology Solutions, Asia, and ASUS United Technology (Shanghai) Co. Ltd. (ASUS) agreed to distribute ASUS Advanced Micro Devices- (AMD-) ... more
June 21, 2007
NEC Chooses Altera Stratix II GX FPGAs for ExpEther Interface Tech
NEC System Platforms Research Laboratories selected the Altera Corp. transceiver-based Stratix II GX field-programmable gate arrays (FPGAs) and ... more
June 21, 2007
TCS XCede Backplane Link Evaluation Kit from Amphenol Evaluates Links Supporting Data Rates up to 20 Gbps
Amphenol TCS (ATCS) announced general availability of its XCede backplane link evaluation kit in three different board materials (Isola FR406, ... more
June 21, 2007
IDC: Study Links Success to Understanding Hidden Relationship between Global PC Supply Chain, OEMs, Service Providers
An IDC study mapping the global PC supply chain highlighted supply chain strategies and trends in the PC industry by identifying the linkages ... more
June 21, 2007
Manufacturing Insights: Executives Call for Improvements in Next-Generation PLM Tools
Research from Manufacturing Insights, an IDC company, identified emerging challenges in product development and the role that the next generation ... more
June 20, 2007
TI Delivers Location Detection System-On-Chip for ZigBee Wireless Sensor Networking
Texas Instruments Inc. (TI) introduced a System-on-Chip (SoC) solution with a hardware location engine targeting low-power ZigBee/Institute of ... more
June 19, 2007
TI, Network Physics Delivering End-User Experience for IP-Based Services
Texas Instruments Inc. (TI) and Network Physics are collaborating on a development initiative centered on delivering optimized end-user experiences ... more
June 19, 2007
Samsung Develops 4 GB Multi-Chip Package
Samsung Electronics Co. Ltd. developed a 4 GB multi-chip package (MCP) for mobile phones. ... more
June 19, 2007
IBM Aims Chip Tech at Communications, Storage, Mobile Markets
IBM announced semiconductor products that use IBM-generated chip technology and target applications in the communications and consumer markets. ... more
June 19, 2007
Intel Introduces '3 Series' Chipsets
Intel unveiled the 3 Series Chipset family along with several other technology plans that surround the company's Intel Core 2 Duo and Quad processors. ... more
June 19, 2007
TI Releases Low-Power Gigabit Ethernet Serializer/Deserializer
Texas Instruments Inc. (TI) introduced a low-power, single-channel Gigabit Ethernet (GbE) serializer/deserializer (SerDes) device, which is designed ... more
June 19, 2007
TI Issues Floating Point Digital Signal Controllers
Texas Instruments Inc. (TI) issued floating point digital signal controllers (DSCs). ... more
June 19, 2007
Dell, Intel, Microsoft Increasing Adoption of NAND-Based Flash Memory in PC Platforms
Adoption of NAND flash memory technology in the PC platform received a boost with the formation of the Non-Volatile Memory Host Controller Interface ... more
June 18, 2007
STMicroelectronics Introduces 32 b Family Powered by ARM Cortex-M3 Core for Embedded Systems
STMicroelectronics (ST) announced a family of 32 b flash microcontrollers (MCUs) based on the ARM Cortex-M3 core - a core with features designed ... more
June 18, 2007
Toyota Deploys PTC Windchill PDMLink as Part of PLM Adoption Project
Toyota Motor Corp. deployed Windchill PDMLink 8.0 from Parametric Technology Corp. (PTC) as part of a process improvement initiative for its ... more
June 18, 2007
Fujitsu Unveils 250 GB 2.5-inch HDD in 9.5 Millimeter-Thin Form Factor in Hong Kong
Fujitsu Hong Kong Ltd. launched the MHY2250BH series of mobile hard disk drives (HDDs) to Hong Kong consumers. ... more
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