Sematech Collaborates with TOK at New Resist Materials, Development Center
May 4, 2009 // Published as a news service by IHS
Tokyo Ohka Kogyo Co. Ltd. (TOK) joined Sematech's Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering of the University at Albany and will team with researchers at Sematech to develop and demonstrate extreme ultraviolet (EUV) materials and resists for use at the 22 nanometer (nm) node and beyond.
The RMDC's mission is to develop resist and materials for 22 nm patterning technologies and beyond and consists of EUV exposure capability and a portfolio of sponsored university research programs, according to Sematech.
At the RMDC, resist and materials suppliers will have access to Sematech's two micro-exposure tools located at the University at Albany's College of Nanoscale Science and Engineering and University of California, Berkeley and can participate in R&D with Sematech member companies.
They will also have access to metrology tools in Sematech's RMDC.
"The RMDC brings together the critical capabilities needed to enable manufacturable EUV," said Bryan Rice, director of lithography at Sematech. "Partnering with resist suppliers such as TOK will accelerate EUV resist development and, in turn, will support timely EUVL [EUV lithography] introduction."
TOK is a manufacturer of photoresists, focusing on semiconductor photoresists and photoresist, ancillary chemical l, as well as liquid crystal display (LCD) photoresists, dielectric materials and processing equipment for semiconductors and LCDs.
Source: Sematech.