AMD Offers Lidless BGA Packaging in Sempron Processors for Embedded Markets
January 26, 2009 // Published as a news service by IHS
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Embedded designers seeking a way to shrink enclosure size while maintaining quality can look to the Sempron 210U and 200U processors from Advanced Micro Devices (AMD), the company said.
The Sempron 210U and 200U processors for embedded systems feature lidless ball grid array (BGA) packaging with the low power and high performance of AMD's direct connect architecture, according to AMD.
"These new lidless BGA packaged processors can help customers significantly shrink their embedded design into new smaller, flatter form factors without having to sacrifice any computing performance," said Buddy Broeker, an embedded product marketing director at AMD.
"Retail touch screens, self-service kiosks and digital signage are a growing part of the consumer experience, and thin client computing continues to play a strong role in helping businesses become more efficient," he said. "These new processor features will help our customers stay on the cutting edge of embedded system design."
AMD said customers can streamline development by pairing the new Sempron processors with the AMD M690E chipset. This platform can speed time to market and deliver the graphics and display options that are important in embedded systems, according to AMD.
Source: Advanced Micro Devices (AMD).