Renesas Releases 50 New MCU Products with R32C/100 CPU Core, High-Speed On-Chip Flash Memory
February 22, 2008 // Published as a news service by IHS
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Renesas Technology Corp. announced 50 products composing 11 groups as new additions to its R32C/100 series of microcontroller units (MCUs) with on-chip flash memory for automotive systems such as controllers for body, chassis and airbag units and industrial equipment for factory automation.
The MCUs in this series are built around the R32C/100 32 b central processing unit (CPU) core from the M16C family of complex instruction set computer (CISC) MCUs.
Sample shipments will begin in May 2008 in Japan with the R32C/120 and R32C/121 groups, which can be used for applications such as body control.
These will be followed in July 2008 by the R32C/133 and R32C/134 groups with on-chip peripheral functions including a communication controller supporting FlexRay, a next-generation automotive communications protocol.
Sample shipments of the R32C/151, R32C/152, R32C/153, R32C/156, R32C/157, R32C/160, and R32C/161 groups will begin in July 2008 sequentially in Japan.
According to Renesas, in the automotive systems field, the number of electronic control units (ECUs) used per vehicle has increased, with a resulting increase in the volume of data transferred over automotive local area networks (LANs).
In addition, control methods are becoming more complex, which has led to an increase in the size of the software programs used to implement them. As a result, demand is growing for MCUs (the core devices in ECUs) with sophisticated functions and improved performance to execute large programs rapidly, Renesas said.
The R32C/100 series offers on-chip peripheral and communication functions including multichannel controller area network (CAN) support and a communication controller implementing the FlexRay high-speed communication protocol.
The features common to all 11 product groups include:
- R32C/100 CPU core, including improved CPU architecture, 32 b multiplier, single-precision floating point unit (FPU) and high-functionality barrel shifter.
- High-speed flash memory. Renesas said the write speed of the new MCUs is about three times faster than that of the M32C/80 series, allowing large amounts of data to be written to the flash memory in less time.
- On-chip flash memory that can be used instead of electrically erasable programmable read-only memory (EEPROM) to store data. The new MCUs feature on-chip flash memory for data storage called EEPROM emulation flash (E2 data flash).
This E2 data flash has 100,000 rewrite cycles available and small graduation 32 B block size for erase function and includes a background operation (BGO) function that allows the CPU to access programs stored in the flash memory while the contents of the E2 data flash are being rewritten.
This function provides flexibility equivalent to that of EEPROM, since data can be rewritten while an application is running, and it contributes to reduced overall system cost, because external EEPROM is no longer needed, Renesas said.
- New single-wire debugging (NSD) interface. On-board debugging functionality, which allows evaluation and calibration to be performed with the MCU installed in the finished product, is in demand for applications such as automotive systems, according to Renesas.
The new MCUs incorporate a single-wire debugging interface that enables connection of an emulator via a single wire, which carries the signals used for debugging. This allows debugging of all functions, and the on-chip flash memory can be programmed on board via the same interface.
- On-chip peripheral functions. Each new MCU product group includes a range of on-chip peripheral functions useful for automotive control applications.
These include timers for three-phase motor control, watchdog timer, advanced intelligent input/output (I/O), analog-to-digital converter (ADC), serial interface, direct memory access (DMA) controller and CAN. In addition, power consumption can be reduced by using the on-chip oscillator in conjunction with wait mode.
In addition to the common features, these groups also combine different flash memory and random access memory (RAM) capacities, configuration and number of channels of CAN and local interconnect network (LIN):
- R32C/120 and R32C/121 groups have a maximum operating frequency of 64 MHz and use a 100 pin low-profile quad flat package (LQFP). The R32C/120 is available with 128 KB or 256 KB of flash memory, and the R32C/121 with 128 KB, 256 KB, 384 KB or 512 KB of flash memory. The basic peripheral function configuration of both groups can be used for a variety of ECU applications.
- R32C/133 and R32C/134 groups offer a maximum operating frequency of 60 MHz and use a 144 pin LQFP. They are both available with 256 KB, 384 KB or 512 KB of flash memory. A FlexRay controller (version 2.1 compliant) is implemented on-chip.
- R32C/151, R32C/152, R32C/153, R32C/156 and R32C/157 groups have a maximum operating frequency of 64 MHz and use a 144 pin LQFP. The R32C/151, R32C/152 and R32C/153 are available with 768 KB or 1,024 KB of flash memory, and the R32C/156 and R32C/157 with 256 KB, 384 KB or 512 KB of flash memory.
The MCUs in these groups can be configured with up to four CAN and eight LIN (hardware-frame-based) channels, with a variety of combinations of different numbers of channels available. The maximum flash memory capacity of 1,024 KB provides support for applications using large software programs.
- R32C/160 and R32C/161 have a maximum operating frequency of 48 MHz and use an 80 pin LQFP. They are both available with 128 KB or 256 KB of flash memory. These groups are targeted at applications where the emphasis is on low cost and compact size.
Source: Renesas Technology Corp.