IPC Releases Component Identification Training, Reference Guide - IPC DRM-18H

January 13, 2008 // Published as a news service by IHS

This component identification resource for electronics assembly operators and inspectors contains detailed descriptions of more than 50 common through hole and surface mount components used in electronics assembly.

The new Revision H contains updated information on:

• Small shrink outline package (SSOP).
• Thin small outline package (TSOP).
• Quad flat pack (QFP).
• Low-profile quad flat pack (LQFP).
• Plastic quad flat package (PQFP).
• Leadless chip carrier (LCC).
• Quad flat no-lead (QFN).
• Ball grid array (BGA)-related packages including all the variations within those groups.

New components include dual flat no-lead (DFN), quad flat no-lead (QFN) multi-row, package on package (PoP), chip scale package (CSP), chip on board (COB), bare die and flip chip.

In addition, a new section was added that stresses the dangers of cross contamination when using lead-free components and assemblies.

The terminology section of the reference guide has facts on polarity, orientation, lead styles and component reference designators (CRDs).

The reading component values section includes color code charts for resistors and inductors and charts for reading numbered capacitor data.

Source: IPC - Association Connecting Electronics Industries.