ARM, Chartered, IBM, Samsung Collaborate on 32 nm, 28 nm SoCs for Embedded Applications
October 2, 2008 // Published as a news service by IHS
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IBM, Chartered Semiconductor Manufacturing Ltd., Samsung Electronics Co. Ltd. and ARM will develop a 32 nanometer (nm) and 28 nm systems-on-chip (SoCs) design platform based on high-k metal-gate (HKMG) technology from the IBM-led joint-development alliance.
This technology targets a range of embedded segments, including mobile, portable and consumer electronics.
Under this multiyear collaboration, ARM will develop and license a design platform of physical intellectual property (IP) including logic, memory and interface products for the Common Platform technology alliance of IBM, Chartered and Samsung for distribution to their customers.
ARM said it also intends to develop customized physical IP targeted at achieving optimal power, performance and area for its current and future Cortex processor family leveraging the attributes of the Common Platform HKMG 32 nm/28 nm technology.
According to the alliance, the HKMG technology breaks down the historical barrier of scaling, allowing power and performance advantages by using new material science innovations.
"Through this early engagement, we are creating the foundation for designing power-efficient ARM SoCs for customers of the Common Platform," said Warren East, CEO, ARM.
"By utilizing the strength of our advanced microprocessors, our leadership in physical IP design and advanced technology supported by the Common Platform, customers can accelerate the release of products for electronic devices that service a broad range of consumer applications," East said.
The Common Platform partners said they expect to continue to expand the ecosystem in this collaborative initiative to include more members in the near future.
These additional partners will expand the offering of electronic design automation (EDA) support, services and IP offerings to enable customers to accelerate their time to market on these technologies.
"IBM remains convinced collaborative innovation in an open ecosystem of partners is the key to technology leadership, both now and in the years to come," said Mike Cadigan, general manager, semiconductor solutions, IBM.
"Today's announcement with ARM extends that strategy to the next level, from IBM research through Common Platform manufacturing to the leading consumer application architecture. With the extensions of our agreements to the 32 nm generation, IBM is working together with its alliance partners to deliver leading-edge technology that promises to dramatically change the way we live, work and play," Cadigan said.
Source: IBM.