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Amphenol Releases HDB3 Series High-Density Mother Board, Daughter Board Connectors

March 24, 2008 // Published as a news service by IHS

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Amphenol Aerospace expanded its board level product offerings with the release of HDB3, a high-density brush connector series.

According to Amphenol, HDB3 uses a high-performance brush contact system for reliability in harsh environments, vibration and shock management, resistance to fretting corrosion and durability to more than 100,000 mating cycles.

This new connector series offers .070 inch by .060 inch staggered grid spacing. Optional keys and guide pins have been combined with mounting features to reduce occupied board space.

Available in 40, 80, 120 and 160 contact arrangements, HDB3 is configurable for data rates up to 3.125 Gbps per 100 Ohm differential pair.

A version compliant with the Restriction of the use of certain Hazardous Substances (RoHS) is also available.

Source: Amphenol.

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